Application Profile

Diode Cup Cold Formed with Pedestal in CDA 102 oxygen free copper

Multi die cold formed CDA 102 oxygen free copper/high conductivity cup with pedestal
Cup with Pedestal 3D Rendering Cup with Pedestal Technical Drawing
Use:  Mounting surface/heat sink for diode chip and a brazed terminal.
Material:  CDA 102 oxygen free copper/high conductivity.
Manufacturing Method: 
  • Multi Die cold formed.
  • Manufactured as a complete part on proprietary Sussex Wire designed & built cold form tooling.

 

_____________________________________________________________________


For best ROI in the design stage of your project.

Click Here to Contact a Sussex Engineer.

_____________________________________________________________________

 

Notable Features: 
  • Extremely thin wall thickness on both ends of body.
  • Raised Pedestal inside the counterbore on one end.
  • Low Profile.
Advantages: 
  • Formed from wire with no scrap developed.
  • Production speeds are high allowing for low production costs. Much faster than machining or grinding.
  • Counterbore features provide for built in containment for plastic epoxy mold material enabling whole piece part to be made from copper enhancing heat sink capability.
  • The pedestal area isolates the die mount surface (the flat surface in the middle of the raised pedestal).
  • Smooth area for die mounting.
INFORMATION
 

Sign up for informative quarterly emails on cold forming.



First Name
Last Name
Email
Company
Comments

 




Thank You!


Thank you for signing up for our newsletter.

Sussex Wire values your privacy. If you receive unwanted email, you may opt out to future alerts at any time.


Sussex Wire