Application Profile

Cold Formed Transistor Base

CDA 102 copper cold formed transistor base
Cold formed Transistor Base 3D Rendering Cold formed Transistor Base Technical Drawing
Use:  Heat sink and positional platform on top of which a specialty transistor is built.
Material:  CDA 102 copper.
Manufacturing Method: 
  • Formed in a multi die forming process.

 

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Notable Features: 
  • Raised pedestal in a Conical Pyramid shape.
  • Off-center notch and off-center pierced hole.
  • Very thin, flat, hockey puck configuration.
  • Good surface finish. No machining marks or cutter machining marks present.
Advantages: 
  • Cost. The production run rate by cold forming this part is many times quicker than the machining process, resulting in a lower overall cost.
  • Density of the copper is usually higher than in a mim process.
  • This component is made from forged copper wire, not a powder form of copper.
  • Good thermal dissipation, strength, and solderability/plating characteristics.
  • This component is a good example showing some non-radially symmetric features usually not thought to be possible using cold forming methods.
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