Application Profile

Semiconductor Diode Cup

Multi die cold formed CDA 102 oxygen free copper/high conductivity semiconductor diode cup
Semiconductor Diode Cup 3D Rendering Semiconductor Diode Cup Technical Drawing
Use:  Mounting surface/body for diode chip and a brazed terminal.
Material:  CDA 102 oxygen free copper/high conductivity.
Manufacturing Method: 
  • Multi Die cold formed. Manufactured as a complete part on proprietary Sussex Wire designed & built cold form tooling.



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Notable Features: 
  • Wall thickness is much thicker at bottom than the side walls for heat sink purposes.
  • Intermittant retention barbs on inside diameter of wall.
  • Formed from wire with no scrap developed.
  • Production speeds are high allowing for low production costs. Much faster than machining or grinding.
  • The retention feature holds tight the molded plastic.
  • Smooth area for die mounting.
  • The cup shape is deep due to the amount of plastic needed to fill the device.

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