Application Profile

Diode Cup

Multi die cold formed CDA 102 oxygen free copper/high conductivity diode cup
Diode Cup 3D Rendering Diode Cup Technical Drawing
Use:  Mounting surface/heat sink for diode chip and a brazed terminal.
Material:  CDA 102 oxygen free copper/high conductivity.
Manufacturing Method: 
  • Multi Die cold formed.
  • Manufactured as a complete part on proprietary Sussex Wire designed & built cold form tooling.



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Notable Features: 
  • Precise knurl on OD of cup for press fit application into an alternator bridge.
  • Retention ring on inside diameter of wall.
  • Very thin inside moat against the bottom edge/inside the wall.
  • Formed from wire with no scrap developed.
  • Production speeds are high allowing for low production costs. Much faster than machining or grinding.
  • The retention feature holds tight the molded plastic.
  • The moat area isolates the die mount surface (the flat surface in the middle of the cup) from the insertion forces developed when pressing the device into the alternator bridge.
  • Smooth area for die mounting.

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