Application Profile

Diode Cup Cold Formed with Pedestal in CDA 102 oxygen free copper

Multi die cold formed CDA 102 oxygen free copper/high conductivity cup with pedestal
Cup with Pedestal 3D Rendering Cup with Pedestal Technical Drawing
Use:  Mounting surface/heat sink for diode chip and a brazed terminal.
Material:  CDA 102 oxygen free copper/high conductivity.
Manufacturing Method: 
  • Multi Die cold formed.
  • Manufactured as a complete part on proprietary Sussex Wire designed & built cold form tooling.



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Notable Features: 
  • Extremely thin wall thickness on both ends of body.
  • Raised Pedestal inside the counterbore on one end.
  • Low Profile.
  • Formed from wire with no scrap developed.
  • Production speeds are high allowing for low production costs. Much faster than machining or grinding.
  • Counterbore features provide for built in containment for plastic epoxy mold material enabling whole piece part to be made from copper enhancing heat sink capability.
  • The pedestal area isolates the die mount surface (the flat surface in the middle of the raised pedestal).
  • Smooth area for die mounting.

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