Cup with Pedestal
Application Profile
Diode Cup Cold Formed with Pedestal in CDA 102 oxygen free copper
Use:
Mounting surface/heat sink for diode chip and a brazed terminal.
Material:
CDA 102 oxygen free copper/high conductivity.
Manufacturing Method:
- Multi Die cold formed.
- Manufactured as a complete part on proprietary Sussex Wire designed & built cold form tooling.
_____________________________________________________________________
For best ROI in the design stage of your project.
Click Here to Contact a Sussex Engineer.
_____________________________________________________________________
Notable Features:
- Extremely thin wall thickness on both ends of body.
- Raised Pedestal inside the counterbore on one end.
- Low Profile.
Advantages:
- Formed from wire with no scrap developed.
- Production speeds are high allowing for low production costs. Much faster than machining or grinding.
- Counterbore features provide for built in containment for plastic epoxy mold material enabling whole piece part to be made from copper enhancing heat sink capability.
- The pedestal area isolates the die mount surface (the flat surface in the middle of the raised pedestal).
- Smooth area for die mounting.
INFORMATION
