Application Profile

Cold Formed Transistor Base

CDA 102 copper cold formed transistor base
Cold formed Transistor Base 3D Rendering Cold formed Transistor Base Technical Drawing
Use:  Heat sink and positional platform on top of which a specialty transistor is built.
Material:  CDA 102 copper.
Manufacturing Method: 
  • Formed in a multi die forming process.



For best ROI in the design stage of your project.

Click Here to Contact a Sussex Engineer.



Notable Features: 
  • Raised pedestal in a Conical Pyramid shape.
  • Off-center notch and off-center pierced hole.
  • Very thin, flat, hockey puck configuration.
  • Good surface finish. No machining marks or cutter machining marks present.
  • Cost. The production run rate by cold forming this part is many times quicker than the machining process, resulting in a lower overall cost.
  • Density of the copper is usually higher than in a mim process.
  • This component is made from forged copper wire, not a powder form of copper.
  • Good thermal dissipation, strength, and solderability/plating characteristics.
  • This component is a good example showing some non-radially symmetric features usually not thought to be possible using cold forming methods.

Sign up for informative quarterly emails on cold forming.

First Name
Last Name


Thank You!

Thank you for signing up for our newsletter.

Sussex Wire values your privacy. If you receive unwanted email, you may opt out to future alerts at any time.

Sussex Wire