Application Profile

Wire Bond Pin

52 alloy per ASTM f-30 Cold headed Wire Bond Pin
Wire Bond Pin 3D Rendering Wire Bond Pin Technical Drawing
Use:  Wire bond component in high volume glass to metal seal (hermetic) electronic device.
Material:  52 alloy per ASTM f-30 (nickel/iron alloy - glass to metal seal quality).
Manufacturing Method: 
  • Formed on slide machine with secondary for wire bond surface finish.



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Notable Features: 
  • Double (identical) notches at either end.
  • Very high surface finish. No machining lines or machining tit present at either end of the part on the notches.
  • Very good surface finish present on the sealing surfaces. No leak paths.
  • Surface finishes are smooth for good hermetic sealing characteristics. No machining marks/spirals/inclusions are present.

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